Optimization of Ultrasonic Cleaning for Erosion-Sensitive Microelectronic Components
Submicron microparticle contamination is a major cause of device failure and production process loss in many microelectronic industries such as semiconductor devices, integrated circuits, hard disks, etc. Due to the shrinking dimensions of the product in the miniaturized market, the minimum particle size that can cause defects continues to decrease, so ultrasonic cleaners can be an excellent choice for removing contamination, even in very delicate parts.
